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KINGSTON DDR3 2GB 1600MXZ CL9 HX BLU memorias ram KINGSTON DDR3 2GB 1600MXZ CL9 HX BLU KINGSTON DDR3 2GB 1600MXZ CL9 HX BLU
KINGSTON DDR3 2GB 1600MXZ
CL9 HX BLU

Kingston´s 256M x 64-bit 2GB (2048MB) DDR3-1600MHz CL9 SDRAM (Synchronous DRAM) memory module, based on sixteen 128M x 8-bit DDR3 FBGA components. This module has been tested to run at DDR3-1600MHz at a low latency timing of 9-9-9-27 at 1.7V to 1.9V. The SPD is programmed to JEDEC standard latency DDR3-1333MHz timing of 9-9-9 at 1.5V. This 240-pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC standard electrical and mechanical specifications are as follows:

Features:

•JEDEC standard 1.5V ± 0.075V Power Supply
•VDDQ = 1.5V ± 0.075V
•667MHz fCK for 1333Mb/sec/pin
•8 independent internal bank
•Programmable CAS Latency: 5,6,7,8,9,10
•Posted CAS
•Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
•Programmable CAS Write Latency(CWL) = 7(DDR3-1333)
•8-bit pre-fetch
•Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4
•which does not allow seamless read or write [either on the fly using A12 or MRS]
•Bi-directional Differential Data Strobe
•Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
•On Die Termination using ODT pin
•Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE . 95°C
•Asynchronous Reset
•PCB : Height 1.180” (30.00mm), double sided component
PerformanceMANCE:

•CL(IDD) 9 cycles
•Row Cycle Time (tRCmin) 49.5ns (min.)
•Refresh to Active/Refresh Command Time (tRFCmin) 110ns
•Row Active Time (tRASmin) 36ns (min.)
•Power 1.800 W (operating)
•UL Rating 94 V - 0
•Operating Temperature 0o C to 85o C
•Storage Temperature -55o C to +100o C

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MEMORIAS RAM