General information
TypeCPU / Microprocessor
Market segmentDesktop
FamilyIntel Core i3
Model numberI3-560
Frequency (MHz)3333
Package1156-land Flip-Chip Land Grid Array (FC-LGA10)
1.48" x 1.48" (3.75 cm x 3.75 cm)
SocketSocket 1156 (LGA1156)
Architecture / Microarchitecture
MicroarchitectureNehalem (Westmere)
Processor coreClarkdale
Manufacturing process0.032 micron
Data width64 bit
Number of cores2
Floating Point UnitIntegrated
Level 1 cache size2 x 32 KB instruction caches
2 x 32 KB data caches
Level 2 cache size2 x 256 KB
Level 3 cache size4 MB shared cache
MultiprocessingUniprocessor
Low power features
Thread C1, C3 and C6 states
Core C1/C1E, C3 and C6 states
Package C1/C1E, C3 and C6 states
Enhanced SpeedStep technology
On-chip peripherals
Integrated dual-channel DDR3 SDRAM Memory controller
Direct Media Interface
Integrated HD graphics controller
Electrical/Thermal parameters
Thermal Design Power (W)73
